- Die Attachment (Die Bonding)
A process of bonding semiconductor dies to insulating substrates or packages using adhesive materials or other substances. - A production equipment essential for semiconductor packaging, LCD aging, and bubble removal, which relies on precise and accurate pressure and temperature control for heating and pressurizing.
- PID Auto-tuning controller
Precise temperature control is achievable by finding the appropriate PID values based on the surrounding environment. Digital LED or LCD(Option) - Interlock system - Protecting users from any types of defaults or problems that may occur.
- Fail safe - Blocking all the power along with circuit breakers
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IR-PC-1200-2100L
Purpose
Autoclave for aircraft parts manufacturing, composite moldingFeature
A process of bonding semiconductor dies to insulating substrates or packages using adhesive materials or other substances.
Precise temperature control is achievable by finding the appropriate PID values based on the surrounding environment. Digital LED or LCD(Option)
Specification