- Automation of the entire process is possible with the introduction of an automated system, including logistics.
- Large-scale production and high efficiency in process time and manpower input
- Die Attachment (Die Bonding)
A process of attaching a semiconductor die to an insulating substrate or package using materials such as adhesives. - A production equipment essential for aging and air bubble removal in semiconductor packaging, LCDs, etc., based on accurate and precise control of pressure and temperature, with heating and pressurization.
- PID Auto-tuning controller
Precise temperature control is possible by finding the optimal PID values according to the surrounding environment. Digital LED or LCD(Option) - Interlock system - In case of artificial or natural malfunctions or errors, the safety mechanism automatically defends itself to prevent further experimentation.
- Fail safe - In the event of a malfunction or issue with the safety operating device, the power supply to various parts is automatically cut off, and the system remains in a standby state with only the grounding connected. This feature enhances user safety by protecting against potential hazards.
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IRIA-1100S
Purpose
Production in large quantity & maximizing work-efficiencyFeature
A process of attaching a semiconductor die to an insulating substrate or package using materials such as adhesives.
Precise temperature control is possible by finding the optimal PID values according to the surrounding environment. Digital LED or LCD(Option)
Product Classification
Components