Autoclave / General Type

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IR-PC-700 


Purpose

The Autoclave is widely used in Semiconductor packaging, Touch Panel/LCD lamination, Die attachment or bonding.


Feature

  • A production equipment essential for the electronics component industry, such as for aging, air bubble removal, and crack inspection of LCDs, batteries, phone films, and displays.
  • The specially designed flange can withstand pressures up to 35 bar. (pressure range is adjustable)
  • The high-strength packing structure provides excellent vacuum and pressure retention.
  • A production equipment essential for aging and air bubble removal in semiconductor packaging, LCDs, etc., based on accurate and precise control of pressure and temperature, with heating and pressurization.
  • PID Auto-tuning controller
  • Precise temperature control is possible by finding the optimal PID values according to the surrounding environment. Digital LED or LCD(Option)
  • Interlock system - In case of artificial or natural malfunctions or errors, the safety mechanism automatically defends itself to prevent further experimentation. 
  • Fail safe - In the event of a malfunction or issue with the safety operating device, the power supply to various parts is automatically cut off, and the system remains in a standby state with only the grounding connected. This feature enhances user safety by protecting against potential hazards. 


Specification

ModelIR-DPC-600 (Dual Chamber)
Heating MethodConvection
Dimension (mm)InternalW440 × D390 × H550
ExternalW1500 × D2180 × H1900
Process Chamber MaterialSUS304 Polishing
Temperature Control MethodProgrammable PID Control
Thermocouple TypeK-Type
Temp UniformitySet temp. ±3℃ at 60℃ (Design Temp : 230℃)
Chamber working pressure16 kgf/㎠ (Max 22 kgf/㎠)
Pressurizing methodProvided by CDA & Booster
Pressure ControlIncrease / Decrease: Valve (segments) control
HeaterSheath Pin Heater
Air circulating methodSirocco Fan + Motor
Motor Shaft SealingMagnetic Driver Seal




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