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IR-PC-620-1400F / IR-PC-1600-2000F
Purpose - For removing air bubbles from the touch panel
- Equipment capable of controlling the pressure and temperature according to the process
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Feature
- Die Attachment (Die Bonding)
A process of attaching a semiconductor die to an insulating substrate or package using materials such as adhesives. - A production equipment essential for aging and air bubble removal in semiconductor packaging, LCD, etc., based on precise and accurate control of pressure and temperature, with controlled heating and pressing.
- PID Auto-tuning controller
Able to find the optimal PID values according to the surrounding environment for precise temperature control. Digital LED or LCD(Option) - Interlock system - A safety mechanism that automatically defends itself to prevent further experimentation in case of artificial or natural malfunctions or errors.
- Fail safe - In case of a malfunction, if there is an issue with the safety operating device, the power supply to various parts is automatically cut off, and the system remains in a standby state with only the grounding part connected. This feature enhances user safety by protecting against potential hazards.
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Specification
| Model | IR-PC-1800-2400L | IR-PC-2000-2200L |
| Controller | Temperature 5℃ to 35℃ Maximum relative humidity 85%RH
Altitude up to 2,000m |
| Chamber Volume (ℓ) | 6110L / 7000L |
| Heater Power (Kw) | 12KW / 40KW |
| Temperature | Range | 50℃ ~ 100℃(5~40℃ when cooling is used) |
| Control | 0.1℃ |
| Accuracy | ±1℃ at 100℃ |
| Controller | Digital PID control system |
| Sensor | Pt100 or K-type |
| Stability | ± 1.0℃ |
| Heat up time | 100℃ within 60min |
| Material | Range | Standard 20 (9.5) Option) |
| Degree | 0.5 |
| Interior | Stainless steel |
| Exterior | steel, 1.2t, double painted & baked |
| Shelves | Stainless steel |
| Heater | sheath heater |
| Insulation | Ceramic wool |
| Door packing | Heat resistance silicone rubber |
| Outer material | Stainless steel flange |
| Heating Method | Both side heating or internal sheatd heater |
Dimension
(W×D×H,mm) | Internal | 1800Ø×2400L | 2000Ø×2000L |
| External | 2900W×4000D×2000H | 3000W×2900D×3000H |
| Power | 220V / 380V / 3P |
※ Size and other specifications are always negotiable with clients' demand.
Note
Products with a pressure exceeding 2bar can only be manufactured after obtaining safety certification according to the regulations of the Korea Occupational Safety and Health Agency. As the certification process may take some time, the production period may be extended.
IR-PC-620-1400F / IR-PC-1600-2000F
Purpose
Feature
A process of attaching a semiconductor die to an insulating substrate or package using materials such as adhesives.
Able to find the optimal PID values according to the surrounding environment for precise temperature control. Digital LED or LCD(Option)
Specification
Altitude up to 2,000m
(W×D×H,mm)
※ Size and other specifications are always negotiable with clients' demand.
Note
Products with a pressure exceeding 2bar can only be manufactured after obtaining safety certification according to the regulations of the Korea Occupational Safety and Health Agency. As the certification process may take some time, the production period may be extended.